1 HUL7281 hologram unit for optical information processing features smaller package size achieved through micro-mirror integration (4.8 8.2 4.3 mm) fast response (f c = 24 mhz) focus error signal detection : ssd method tracking error signal detection : 3 beam method low-power semiconductor laser included application cd-rom drives (supports 8- to 16-time speed cd-rom drives) hologram unit electro-optical characteristics (ta = 25?c) parameter symbol conditions min typ max unit laser beam output *1 p o cw 0.18 0.25 mw operating current i op cw v rf = 420mv, v cc = 5v 25 35 45 ma operating voltage v op cw v rf = 420mv, v cc = 5v 1.9 2.4 v oscillating wavelength l l cw v rf = 420mv, v cc = 5v 775 795 815 nm focus error signal amplitude v fe cw v rf = 420mv, v cc = 5v 180 300 420 mv tracking error signal amplitude v te cw v rf = 420mv, v cc = 5v 170 280 400 mv focus error signal pull-in range d fe cw v rf = 420mv, v cc = 5v 9 12 16 m m frequency characteristics (C3 db) f c 16 24 mhz *1 light emitting output through objective lens unit : mm 0.25 lead frame ?.0* 11.2 8.2 (0.2) (0.5) 4.8 0.1 0.8 5=4.0 (0.35) (0.3) x y o apparent emitting point apparent emitting point index mark for no.1 pin on reverse side reference plane reference plane 4.7 4.7 0.1 4.33 2.55 2.55 3.0 8.1 0.50 0.78 1.33 reference plane (note): 1.standard corner r=0.20 max. 2.tolerance unless otherwise specified is 0.2 3.thickness of plate:ni 1 m min.+au 0.1 m min. 4.thickness of hologram=2.0mm, n=1.519 5.tolerance of dimension with *(asterisk) is +0/?.05 6 5 4 3 2 1 7 8 9 10 11 12 sec. x-o-y sec. x-o-y absolute maximum ratings (ta = 25?c) parameter symbol ratings unit laser beam output *1 p o 0.3 mw reverse voltage laser v r(ld) 2v monitor v r(mon) 6v supply voltage v r 6v operating ambient temperature t opr C 10 to +60 ?c storage temperature t stg C 40 to +85 ?c *1 light emitting output through objective lens maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
2 hologram unit HUL7281 1: gnd 2: mon. out 3: n.c. 4: (p2+p4+p8) out 5: v c 6: (p1+p6) out 7: gnd 8: (p5+p10) out 9: v cc 10: (p3+p7+p9) out 11: ld (+) 12: ld (? p2 pmon p4 p8 p1 p3 p7 p9 p5 p6 p10 ld 11 10 9 8 6 5 4 7 112 2 + + + + 3 band gap reg. i ?l , i ? 2.0 1.5 1.0 i op (ma) p o (mw) , v op (v) 20 30 40 50 0.0 0.5 010 = i? = i? block diagram of circuit functions maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. caution for safety danger this product contains gallium arsenide (gaas). gaas powder and vapor are hazardous to human health if inhaled or ingested. do not burn, destroy, cut, cleave off, or chemically dissolve the product. follow related laws and ordinances for disposal. the product should be excluded from general industrial waste or household garbage. do not touch or look into the laser beam directly. the laser beam may cause injury to the eye or skin, or loss of eyesight. if you have any inquiries or questions about this book or our semiconductor products, please contact one of our sales offices listed on the back or semiconductor company's department. maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
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